Fiimu Shielding EMI jẹ lilo akọkọ ni FPC eyiti o ni Awọn modulu fun awọn foonu alagbeka, PC, awọn ẹrọ iṣoogun, awọn kamẹra oni-nọmba, awọn ohun elo ọkọ ayọkẹlẹ, ati bẹbẹ lọ.
LKES-800
LKES-1000
LEKS-6000
(1) Ti o dara processing abuda
(2) Ti o dara itanna elekitiriki
(3) Ti o dara shielding-ini
(4) Ti o dara ooru resistance
(5) Ọrẹ ayika (Ọfẹ Halogen, pade awọn ibeere ti Awọn itọsọna RoHS ati REACH, ati bẹbẹ lọ)
LKES -800
Nkan | Idanwo Data | Igbeyewo bošewa tabi Igbeyewo ọna |
Sisanra (Ṣaaju Lamination,mm) | 16±10% | Standard Enterprise |
Sisanra (Lẹhin Lamination,mm) | 13±10% | Standard Enterprise |
Ilẹ Resistance(Gold palara,Phi1.0mm, 1.0cm,Oh) | HE C5016 1994-7.1 | |
Agbara peeling ti fiimu fikun (N/25mm) | Standard Enterprise | |
Atunse Soldering laisi asiwaju (MAX 265℃) | Ko si stratification; Ko si foomu | HE C6471 1995-9.3 |
Olutaja (288℃, 10s, 3 igba) | Ko si stratification; Ko si foomu | HE C6471 1995-9.3 |
Awọn ohun-ini aabo (dB) | > 50 | GB/T 30142-2013 |
Dada Resistance(mOh/□) | .350 | Mẹrin ebute Ọna |
Ina Retardant | VTM-0 | UL94 |
Titẹ sita kikọ | KỌJA | JIS K5600 |
Didan(60°, Gs) | .20 | GB9754-88 |
Idaabobo kemikali(Acid, alkali ati OSP) | KỌJA | HE C6471 1995-9.2 |
Adhesion si Stiffener (N/cm) | :4 | IPC-TM-650 2.4.9 |
LKES-1000
Nkan | Idanwo Data | Igbeyewo bošewa tabi Igbeyewo ọna |
Sisanra (Lẹhin Lamination,mm) | 14-18 | Standard Enterprise |
Awọn ohun-ini aabo (dB) | ≥50 | GB/T 30142-2013 |
Dada idabobo | ≥200 | Standard Enterprise |
Alemora Yara(idanwo ọgọọgọrun awọn sẹẹli) | Ko si sẹẹli ṣubu | JIS C 6471 1995-8.1 |
Sooro si Ọtí Mu ese | 50 Igba ko si bibajẹ | Standard Enterprise |
ibere Resistance | 5 igba ko si jijo ti irin | Standard Enterprise |
Resistance ilẹ, (Gold plating,Phi1.0mm, 1.0cm,Oh) | ≤1.0 | HE C5016 1994-7.1 |
Atunse Soldering laisi asiwaju (MAX 265℃) | Ko si stratification; Ko si foomu | HE C6471 1995-9.3 |
Olutaja (288℃, 10s, 3 igba) | Ko si stratification; Ko si foomu | HE C6471 1995-9.3 |
Titẹ sita kikọ | KỌJA | JIS K5600 |
LKES-6000
Nkan | Idanwo Data | Igbeyewo bošewa tabi Igbeyewo ọna |
Sisanra (Lẹhin Lamination,mm) | 13±10% | Standard Enterprise |
Awọn ohun-ini aabo (dB) | ≥50 | GB/T 30142-2013 |
Resistance ilẹ, (Gold palara,Phi1.0mm, 1.0cm,Oh) | ≤0.5 | HE C5016 1994-7.1 |
Resistance ilẹ, (Gold palara,Phi1.0mm, 3.0cm,Oh) | 0.20 | HE C5016 1994-7.1 |
Agbara itusilẹ (N/cm) | Standard Enterprise | |
Dada idabobo(mOh) | ≥200 | Standard Enterprise |
Alemora Yara(idanwo ọgọrun) | Ko si sẹẹli ṣubu | JIS C 6471 1995-8.1 |
Atunse Soldering laisi asiwaju (MAX 265℃) | Ko si stratification; Ko si foomu | HE C6471 1995-9.3 |
Olutaja (288℃, 10s, 3 igba) | Ko si stratification; Ko si foomu | HE C6471 1995-9.3 |
Ina Retardant | VTM-0 | UL94 |
Titẹ sita kikọ | KỌJA | JIS K5600 |
Lamination Ọna | Lamination majemu | Ipo imuduro | |||
Iwọn otutu (℃) | Titẹ (kg) | Àkókò | Iwọn otutu (℃) | wakati (iṣẹju) | |
Awọn ọna- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Akiyesi: Onibara le ṣatunṣe imọ-ẹrọ ti o da lori ipo gidi nigba ṣiṣe.
(1)Pe ipele aabo kuro ni akọkọ, ati lẹhinna sopọ mọ FPC, 80℃Alapapo tabili le ṣee lo fun ami imora.
(2)Laminate ni ibamu pẹlu ilana ti o wa loke, mu jade, lẹhinna yọ fiimu ti ngbe lẹhin itutu agbaiye.
(3)Solidification ilana.
(1) Isọdi Ọja: 250mm × 100m.
(2) Lẹhin yiyọ ina aimi, awọn ọja ti wa ni aba ti aluminiomu bankanje iwe ati ki o tun fi drier ni o.
(3) Ita ti wa ni aba ti ni iwe paali ati ti o wa titi lati rii daju aabo ti awọn ọja nigba gbigbe ati mimu, ki o si yago fun bibajẹ.
(1) Ipo Ibi ipamọ ti a ṣe iṣeduro
Iwọn otutu: (0-10) ℃; Ọriniinitutu: labẹ 70% RH
(2) Ifarabalẹ
(2.1) Jọwọ ma ṣe ṣii package ita ati iwọntunwọnsi fiimu idabobo ni iwọn otutu yara fun awọn wakati 6 ṣaaju lilo lati dinku ipa ti Frost ati ìri lori fiimu idabobo.
(2.2) Daba lati ṣee lo ni kete bi o ti ṣee lẹhin ti o jade lati ibi ipamọ tutu, ni ọran ti iyipada didara labẹ iwọn otutu deede fun igba pipẹ.
(2.3) Ọja yii ko ni sooro si oluranlowo ifasilẹ alakoso omi ati ṣiṣan, ti o ba ni imọ-ẹrọ sisẹ loke, jọwọ ṣe idanwo ati jẹrisi akọkọ.
(2.4) Daba lamination iyara, igbale laminating nilo lati ni idanwo ati timo.
(2.5) Akoko iṣeduro didara labẹ ipo ti o wa loke jẹ oṣu 6.